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Ultratech Model 1500/1700

Available Now!

Email: info@ksequipment.com
Phone: ( 831 ) 722-7173
Condition: Refurbished
Serial number:

The Ultratech Stepper 1500/1700 features:

  •  Machine vision alignment
  •  Large depth of focus
  •  Multiple fields per reticle
  •  1.4um or optional 1.0um resolution
  •  Automatic site-by-site alignment
  •  Air probe electronic focus detection
  •  Flexible field size
  •  Wafer thickness compensator
  •  Broadband exposure (g/h-line)
  •  High wafer plane irradiance
  •  3 X 5 x 0.090 or 5 x 5 0.090 inch reticle

SPECIFICATIONS:

  •  Wafer Size:  3", 4", 5", 6", or 8"
  •  Loader type: Automation/Manual
  •  Machine Vision: PatMax
  •  Computer: HP 362
  •  Depth of Focus: 3.0 ums @1.0um lines
  •  Depth of Focus: 7.0 ums @1.4um lines
  •  Uniformity: 2.5%
  •  Reticle Size 3" x 5" x 0.090"
  •  Maximum Area 34.2 x 13.6 mm
  •  Maximum Aspect: 39 x 11.4 mm
  •  High wafer plane irradiance
  •  Maximum Square 18 x 18 mm
Ultratech Stepper 1700 ABS

KS Equipment, Inc.
17 Hangar Way
Watsonville, CA 95076

831-722-7173
FAX: 831-722-2038

Email: info@ksequipment.com

UTS 1700 ABS UTS 1700 ABS
The UTS 1500/1700 is available with an Automation or Manual Loader.
The Ultratech Stepper 1500/1700 is the most widely used thin film head (TFH) lithography tool for high-volume manufacturing used today. It incorporates an advanced machine vision system and custom software designed for rowbar level processing. Available with automation or manual loader.
Ultratech Stepper 1700 ABS