The Ultratech Stepper 1500/1700 features: |
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- Machine vision alignment
- Large depth of focus
- Multiple fields per reticle
- 1.4um or optional 1.0um resolution
- Automatic site-by-site alignment
- Air probe electronic focus detection
- Flexible field size
- Wafer thickness compensator
- Broadband exposure (g/h-line)
- High wafer plane irradiance
- 3 X 5 x 0.090 or 5 x 5 0.090 inch reticle
SPECIFICATIONS:
- Wafer Size: 3", 4", 5", 6", or 8"
- Loader type: Automation/Manual
- Machine Vision: PatMax
- Computer: HP 362
- Depth of Focus: 3.0 ums @1.0um lines
- Depth of Focus: 7.0 ums @1.4um lines
- Uniformity: 2.5%
- Reticle Size 3" x 5" x 0.090"
- Maximum Area 34.2 x 13.6 mm
- Maximum Aspect: 39 x 11.4 mm
- High wafer plane irradiance
- Maximum Square 18 x 18 mm
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KS Equipment, Inc.
17 Hangar Way
Watsonville, CA 95076
831-722-7173
FAX: 831-722-2038
Email: info@ksequipment.com
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The UTS 1500/1700 is available with an Automation or Manual
Loader. |
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The Ultratech Stepper 1500/1700 is the most widely
used thin film head (TFH) lithography tool for high-volume manufacturing
used today. It incorporates an advanced machine vision system and
custom software designed for rowbar level processing. Available
with automation or manual loader.
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