| The GAMMA 2130 for 300
mm wafers is designed for front-end-of-line (FEOL) photoresist strip
applications, where high productivity and low CoO are prime considerations.
Featuring a MultiStation Sequential Processing (MSSP) architecture
that incorporates six stations within a single process chamber,
the GAMMA 2130 can remove both the low-dose and the more challenging
high-dose implanted photoresist at a 30 percent higher throughput
than its nearest competitor. By virtue of its very simple design,
the high productivity and high reliability of GAMMA contributes
to a CoO that is as much as 25 percent lower than that of competing
tools. The GAMMA 2130 system is the first robust, production-worthy
300 mm FEOL strip system available on today’s market. |
|
 |
|
