| The GAMMA 2130 for 300 mm wafers
is designed for front-end-of-line (FEOL) photoresist strip applications,
where high productivity and low CoO are prime considerations. Featuring
a MultiStation Sequential Processing (MSSP) architecture that incorporates
six stations within a single process chamber, the GAMMA 2130 can
remove both the low-dose and the more challenging high-dose implanted
photoresist at a 30 percent higher throughput than its nearest competitor.
By virtue of its very simple design, the high productivity and high
reliability of GAMMA contributes to a CoO that is as much as 25
percent lower than that of competing tools. The GAMMA 2130 system
is the first robust, production-worthy 300 mm FEOL strip system
available on today’s market. |
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